Fabrication of damascene Cu wirings using solid acidic catalyst
نویسندگان
چکیده
منابع مشابه
Mold Fabrication for 3D Dual Damascene Imprinting
Previously, a damascene process based on nanoimprint lithography has been proposed (Schmid G M, et al. in J Vac Sci Technol B 24(3) 1283, 2006) to greatly reduce the fabrication steps of metal interconnection in integrated circuit. For such a process to become a viable technique, a mold having two pattern levels with precise alignment between them must be fabricated first. To this end, this wor...
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The effects of interconnect length on the reliability of dual-damascene Cu metallization have been investigated. As in Al-based interconnects, the lifetimes of Cu lines increase with decreasing length. However, unlike Al-based interconnects, no critical length exists, below which all Cu lines are ‘immortal’. Furthermore, we found multi-modal failure statistics for long lines, suggesting multipl...
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In this work, the electromigration ~EM! performance of electroplated damascene Cu is investigated by drift experiments on Blech-type test structures in both polycrystalline and bamboo microstructures. For the first, microtexture data were obtained from electron backscatter diffraction as well. While both bonding areas and 10 mm wide lines were found to have a predominantly random grain orientat...
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ژورنال
عنوان ژورنال: Science and Technology of Advanced Materials
سال: 2007
ISSN: 1468-6996,1878-5514
DOI: 10.1016/j.stam.2006.12.005